The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2021

Filed:

Jul. 11, 2018
Applicant:

Olympus Corporation, Tokyo, JP;

Inventor:

Takanori Sekido, Machida, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61B 1/00 (2006.01); H01L 27/14 (2006.01); B23K 1/005 (2006.01); H04N 7/18 (2006.01); G02B 23/24 (2006.01); A61B 1/05 (2006.01); B23K 1/00 (2006.01); B23K 101/38 (2006.01); H04N 5/225 (2006.01); H01L 27/146 (2006.01); H01R 24/50 (2011.01); H01R 103/00 (2006.01);
U.S. Cl.
CPC ...
A61B 1/00124 (2013.01); A61B 1/0011 (2013.01); A61B 1/00096 (2013.01); A61B 1/00114 (2013.01); A61B 1/00188 (2013.01); A61B 1/00195 (2013.01); A61B 1/05 (2013.01); A61B 1/051 (2013.01); B23K 1/0008 (2013.01); B23K 1/0056 (2013.01); G02B 23/24 (2013.01); H01L 27/14 (2013.01); H04N 7/18 (2013.01); B23K 2101/38 (2018.08); H01L 27/14627 (2013.01); H01R 24/50 (2013.01); H01R 2103/00 (2013.01); H04N 2005/2255 (2013.01);
Abstract

An imaging device that includes at least one lens that collects light incident from an object; an imaging sensor that receives light from the lens and converts it to an electric signal; a multi-layer substrate electrically connected to the imaging sensor that includes electronic components and conductive layers and vias; and a collective cable including at least one coaxial cable. A core connection electrode connected to a core of the coaxial cable is formed on a first surface of the multi-layer substrate, the first substrate intersecting with a height direction of the multi-layer substrate. A shielded-wire connection electrode connected to a shielded wire of the coaxial cable is formed on a side surface of the multi-layer substrate adjacent to the first surface. The side surface faces and the cable extend to a proximal end.


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