The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Apr. 15, 2019
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Young-Shin Choi, Asan-si, KR;

Seul-Ki Han, Asan-si, KR;

Myoun-Kyu Kang, Asan-si, KR;

Ki-Bong Mun, Asan-si, KR;

Du-San Baek, Gumi-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 13/00 (2006.01); H05K 3/36 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0069 (2013.01); H05K 3/36 (2013.01); H05K 1/148 (2013.01); H05K 3/361 (2013.01); H05K 2201/046 (2013.01); H05K 2201/056 (2013.01); H05K 2201/2018 (2013.01); Y10T 29/53187 (2015.01); Y10T 29/53191 (2015.01);
Abstract

An apparatus for combining PCBs may include a pick-up mechanism, a gripping mechanism and a combining mechanism. The pick-up mechanism may pick-up the PCBs connected with each other by a flexible connection member. The gripping mechanism may grip a frame. The combining mechanism may press the flexible connection member using the frame to combine the PCBs with the frame. The process for combining the PCBs with the frame may be automatically performed so that a time for combining the PCBs with the frame is reduced and errors related to the combining process are decreased.


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