The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Nov. 18, 2019
Applicant:

Hitachi, Ltd., Tokyo, JP;

Inventors:

Takeshi Tokuyama, Hitachi, JP;

Kinya Nakatsu, Hitachinaka, JP;

Ryuichi Saito, Hitachi, JP;

Keisuke Horiuchi, Hitachinaka, JP;

Toshiya Satoh, Hitachiota, JP;

Hideki Miyazaki, Hitachi, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/36 (2006.01); H01L 23/473 (2006.01); H01L 25/07 (2006.01); H02M 7/00 (2006.01); H01L 23/367 (2006.01); H01L 23/492 (2006.01); H01L 23/495 (2006.01); H05K 1/02 (2006.01); B60L 15/00 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H02M 7/537 (2006.01); H02P 27/06 (2006.01); B60L 50/51 (2019.01); B60K 6/26 (2007.10); B60K 6/28 (2007.10); B60K 6/46 (2007.10); B60K 17/16 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20927 (2013.01); B60L 15/007 (2013.01); H01L 23/3121 (2013.01); H01L 23/36 (2013.01); H01L 23/3675 (2013.01); H01L 23/473 (2013.01); H01L 23/492 (2013.01); H01L 23/49517 (2013.01); H01L 24/45 (2013.01); H01L 25/072 (2013.01); H02M 7/003 (2013.01); H02M 7/537 (2013.01); H02P 27/06 (2013.01); H05K 1/0262 (2013.01); B60K 6/26 (2013.01); B60K 6/28 (2013.01); B60K 6/46 (2013.01); B60K 17/16 (2013.01); B60L 50/51 (2019.02); B60L 2210/40 (2013.01); B60L 2220/14 (2013.01); B60L 2240/429 (2013.01); B60Y 2200/92 (2013.01); H01L 2224/36 (2013.01); H01L 2224/40 (2013.01); H01L 2224/40137 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01); H05K 7/2089 (2013.01); Y10S 903/906 (2013.01); Y10S 903/907 (2013.01); Y10S 903/909 (2013.01);
Abstract

An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.


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