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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10966324 B1

PDFFull Text
Date of Patent:
Mar. 30, 2021

Filed:

Jun. 12, 2019

Wiring board, multilayer wiring board, and method of manufacturing wiring board

Applicant:

Toppan Printing Co., Ltd., Tokyo, JP;

Inventor:

Yasuyuki Hitsuoka, Tokyo, JP;

Assignee:

TOPPAN PRINTING CO., LTD., Tokyo, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01); H05K 3/10 (2006.01); H05K 3/16 (2006.01); H05K 3/20 (2006.01); H05K 3/30 (2006.01); H05K 3/36 (2006.01); H05K 3/38 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01); H05K 3/06 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/108 (2013.01); H05K 1/11 (2013.01); H05K 1/116 (2013.01); H05K 3/064 (2013.01); H05K 3/067 (2013.01); H05K 3/18 (2013.01); H05K 3/42 (2013.01); H05K 3/427 (2013.01); H05K 3/46 (2013.01); H05K 3/0047 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/1461 (2013.01);
Abstract

A wiring board, a multilayer wiring board, and a method of manufacturing a wiring board adapted to make the filling of through holes and the formation of fine wiring patterns. The wiring board comprises an insulator; a through hole between front and back surfaces of the insulator; a through hole conductor for electrically connecting front and back surface side openings; through hole lands around the front and the back surface side openings, and connected to the through hole conductor; lid plating conductors on the front and the back surface sides, and placed on the respective through hole lands; and wiring patterns formed on the front are compatible and the back surface of the insulator. The thickness of the through hole lands is 1.0 μm or more and 10.0 μm or less, and the area of each lid plating conductor is less than the area of each through hole land.

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