The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Jan. 07, 2019
Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventor:

Hayato Nakano, Nagano, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 23/48 (2006.01); H01L 29/78 (2006.01); H01L 29/739 (2006.01); H01L 29/423 (2006.01); H01L 29/06 (2006.01); H01L 23/498 (2006.01); H05K 3/34 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 21/565 (2013.01); H01L 23/481 (2013.01); H01L 23/49531 (2013.01); H01L 23/49562 (2013.01); H01L 23/49811 (2013.01); H01L 29/0657 (2013.01); H01L 29/0696 (2013.01); H01L 29/42376 (2013.01); H01L 29/7395 (2013.01); H01L 29/7802 (2013.01); H05K 3/3447 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); H01L 29/7393 (2013.01); H05K 2201/1031 (2013.01);
Abstract

A semiconductor device includes: a sealed unit that seals a semiconductor element therein; a connection terminal that is electrically connected to the semiconductor element and is provided so as to project outward from the sealed unit; and a pedestal that is provided to surround a bottom part of an exposed portion of the connection terminal that is exposed from the sealed unit. The pedestal has a base attached to the sealed unit and a guide part that has an inclined side face.


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