The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Dec. 02, 2016
Applicant:

Sony Corporation, Tokyo, JP;

Inventor:

Tsuyoshi Watanabe, Kanagawa, JP;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 5/369 (2011.01); H01L 27/14 (2006.01); H01L 23/00 (2006.01); H01L 27/146 (2006.01); H01L 23/08 (2006.01);
U.S. Cl.
CPC ...
H04N 5/369 (2013.01); H01L 23/08 (2013.01); H01L 24/43 (2013.01); H01L 24/97 (2013.01); H01L 27/14 (2013.01); H01L 27/14618 (2013.01); H01L 27/14621 (2013.01); H01L 27/14623 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01);
Abstract

The present disclosure relates to a solid-state imaging device, a manufacturing method of a solid-state imaging device, and an electronic device capable of preventing occurrence of a flare or a ghost caused by reflection of light in a region other than a light receiving portion of a solid-state imaging element at low cost. The solid-state imaging device includes the solid-state imaging element and a sealing glass which is arranged on the solid-state imaging element and in which a light-shielding resin is embedded in a region corresponding to the region other than the light receiving portion of the solid-state imaging element. The present disclosure is applied to, for example, a solid-state imaging device in which a substrate on which the solid-state imaging element is die-bonded and wire-bonded is packaged, or the like.


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