The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Jan. 18, 2019
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Umar Azad, San Jose, CA (US);

Harish Rajagopalan, San Jose, CA (US);

Mattia Pascolini, San Francisco, CA (US);

Rodney A. Gomez Angulo, Sunnyvale, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 1/24 (2006.01); H01Q 13/10 (2006.01); H01Q 1/48 (2006.01); H01Q 7/00 (2006.01); H01Q 9/42 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/243 (2013.01); H01Q 1/48 (2013.01); H01Q 7/00 (2013.01); H01Q 9/42 (2013.01); H01Q 13/10 (2013.01);
Abstract

An electronic device housing may have a rear housing wall that forms a metal ground plane. A slot may be formed in the metal ground plane. The slot may have one or more open ends along an edge of the ground plane. A near-field communications loop antenna may overlap the slot. The near-field communications loop antenna may have one or more turns. A current path through the metal ground plane may form one of the turns in the near-field communications loop antenna. The slot may form portions of non-near-field-communications antennas in addition to the near-field communications loop antenna. The slot in the non-near-field-communications antennas may be fed using an indirect antenna feed structure. Components such as a capacitor and inductor may help allow non-near-field communications antenna and the near-field communications antenna to be formed from common portions of the metal ground plane.


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