logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10964871 B1

PDFFull Text
Date of Patent:
Mar. 30, 2021

Filed:

Jun. 17, 2020

Micro led structure and method of manufacturing same

Applicant:

Point Engineering Co., Ltd., Asan, KR;

Inventors:

Bum Mo Ahn, Suwon, KR;

Seung Ho Park, Hwaseong, KR;

Tae Hwan Song, Cheonan, KR;

Assignee:

POINT ENGINEERING CO., LTD., Asan, KR;

Attorney:
Primary Examiner:

Jonathan Han

Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 27/12 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 25/0753 (2013.01); H01L 27/1214 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/83851 (2013.01); H01L 2933/0066 (2013.01);
Abstract

The present invention relates to a micro LED structure and a method of manufacturing the same. More particularly, the present invention relates to a micro LED structure and a method of manufacturing the same, the micro LED structure including: a micro LED; a circuit board driving the micro LED; and an anisotropic conductive anodic oxide film provided between the micro LED and the circuit board to electrically connect the circuit board and the micro LED. According to the present invention, without applying an external force (thermocompression bonding) to the anisotropic conductive anodic oxide film, it is possible to electrically connect the circuit board and the micro LED. In addition, it is possible to obtain characteristics such as uniform conductivity in a vertical direction and heat dissipation.

Find Patent Forward Citations

Ahn, Bum. (2021). Micro led structure and method of manufacturing same (U.S. Patent No. 10964871). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10964871

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…