The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

May. 29, 2019
Applicant:

Facebook Technologies, Llc, Menlo Park, CA (US);

Inventors:

Daniel Brodoceanu, Cork, IE;

Thiago Martins Amaral, Saarbrücken, DE;

Pooya Saketi, Cork, IE;

Patrick Joseph Hughes, Cork, IE;

Alexander Udo May, St. Ingbert, DE;

Karsten Moh, Saarbrücken, DE;

Oscar Torrents Abad, Cork, IE;

Assignee:

Facebook Technologies, LLC, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 33/62 (2010.01); H01L 33/56 (2010.01); H01L 25/075 (2006.01); B23K 1/20 (2006.01); B23K 1/005 (2006.01); B23K 1/00 (2006.01); B23K 101/36 (2006.01); H01L 33/30 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); B23K 1/0016 (2013.01); B23K 1/0056 (2013.01); B23K 1/203 (2013.01); H01L 21/67144 (2013.01); H01L 21/67259 (2013.01); H01L 25/0753 (2013.01); H01L 33/56 (2013.01); B23K 2101/36 (2018.08); H01L 33/30 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01);
Abstract

Embodiments relate to using flux or underfill as a trapping layer for temporarily attaching light emitting diodes (LEDs) to a substrate and heating to simultaneously bond multiple LEDs onto the substrate. The flux or underfill may be selectively coated at the ends of electrodes of the LEDs prior to placing the LEDs on the substrate. Due to adhesive properties of the flux or underfill, multiple LEDs can be placed on and attached to the substrate prior to performing the bonding process. Once LEDs are placed on the substrate, the flux or underfill facilitates formation of metallic contacts between electrodes of the LED and contacts of the substrate during the bonding process. By using the flux or underfill, the formation of metallic contacts can be performed even without applying pressure.


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