The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Jan. 16, 2018
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Chui Wai Chong, Seberang Jaya, MY;

Choo Kean Lim, George Town, MY;

Seong Tak Koay, George Town, MY;

Geok Ling Adelene Ng, George Town, MY;

Teng Hai Ocean Chuah, Bukit Mertajam, MY;

Assignee:

OSRAM OLED GmbH, Regensburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/58 (2010.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/52 (2010.01);
U.S. Cl.
CPC ...
H01L 33/58 (2013.01); H01L 33/486 (2013.01); H01L 33/505 (2013.01); H01L 33/52 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0083 (2013.01);
Abstract

A method of producing an optoelectronic element with a light emitting component, includes arranging a sacrificial layer at least above a part of a light emitting side of the component, forming at least in a part of an outer surface of the sacrificial layer an inverted optic structure, covering the outer surface of the sacrificial layer by a light transparent layer, transferring the inverted optic structure to an inner side of the transparent layer, and removing the sacrificial layer and forming a gap between the component and the light transparent layer, wherein the light transparent layer includes at the inner side the optic structure.


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