The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

May. 24, 2019
Applicant:

Primax Electronics Ltd., Taipei, TW;

Inventors:

Hung-Wei Kuo, Taipei, TW;

Ya-Chin Tu, Taipei, TW;

Chung-Yuan Chen, Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/54 (2010.01); H01L 33/62 (2010.01); H01L 33/56 (2010.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); H01L 33/0095 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 2933/005 (2013.01);
Abstract

A method of packaging a semiconductor illumination module is provided. The method includes the following steps. In a step (a), a substrate is provided. The substrate is selected from one of a flexible printed circuit board, a metal core circuit board, a printed circuit board or a ceramic printed circuit board. The substrate includes a solder mask layer with an opening, and the opening has a width R. In a step (b), a light-emitting element is installed in the opening. In a step (c), an encapsulant injection device is used to inject a packaging encapsulant into the opening. In a step (d), a sealed lens structure is formed to cover the light-emitting element, wherein the sealed lens structure has a height h.


Find Patent Forward Citations

Loading…