The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2021
Filed:
Jul. 14, 2018
Applicant:
Broadpak Corporation, San Jose, CA (US);
Inventor:
Farhang Yazdani, Santa Clara, CA (US);
Assignee:
BroadPak Corporation, San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 25/10 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01); H01L 23/13 (2006.01); H01L 23/36 (2006.01); H01L 23/467 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/14 (2006.01); H01L 23/04 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01);
U.S. Cl.
CPC ...
H01L 25/105 (2013.01); H01L 21/486 (2013.01); H01L 21/52 (2013.01); H01L 23/04 (2013.01); H01L 23/13 (2013.01); H01L 23/147 (2013.01); H01L 23/3107 (2013.01); H01L 23/36 (2013.01); H01L 23/467 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/5385 (2013.01); H01L 23/573 (2013.01); H01L 23/66 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 23/5383 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1052 (2013.01); H01L 2225/1082 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/30107 (2013.01); Y10T 29/53174 (2015.01); Y10T 29/53178 (2015.01); Y10T 29/53183 (2015.01);
Abstract
An integrated circuit package comprising a first substrate having a cavity; a second substrate; and one or more semiconductor device(s) and/or passive component (s) are coupled to the second substrate. The cavity is formed using two opposite side walls of the first substrate where two opposite sides of the cavity are kept open, the one or more semiconductor device(s) and/or passive component(s) is/are electrically coupled using redistribution layers, and the second substrate is located inside the cavity of the first substrate.