The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Jul. 16, 2019
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Katsunari Nakazawa, Kyoto, JP;

Takanori Uejima, Kyoto, JP;

Motoji Tsuda, Kyoto, JP;

Yuji Takematsu, Kyoto, JP;

Dai Nakagawa, Kyoto, JP;

Tetsuro Harada, Kyoto, JP;

Masahide Takebe, Kyoto, JP;

Naoya Matsumoto, Kyoto, JP;

Yoshiaki Sukemori, Kyoto, JP;

Mitsunori Samata, Kyoto, JP;

Yutaka Sasaki, Kyoto, JP;

Yuki Fukuda, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/213 (2006.01); H03F 3/21 (2006.01); H03F 1/30 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 23/66 (2006.01); H04B 1/04 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 23/66 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H03F 1/301 (2013.01); H03F 1/302 (2013.01); H03F 3/211 (2013.01); H03F 3/213 (2013.01); H04B 1/04 (2013.01); H01L 2223/6644 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/16235 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13091 (2013.01); H03F 2200/171 (2013.01); H03F 2200/222 (2013.01); H03F 2200/294 (2013.01); H03F 2200/387 (2013.01); H03F 2200/451 (2013.01); H03F 2203/21103 (2013.01); H03F 2203/21139 (2013.01); H03F 2203/21157 (2013.01); H04B 2001/0408 (2013.01);
Abstract

A radio-frequency module includes: a transmission power amplifier that includes first and second amplification transistors that are cascade connected to each other; and a mounting substrate that has first and second main surface that face each other, the transmission power amplifier being mounted on the first main surface. The first amplification transistor is arranged in a final stage and has a first emitter terminal. The second amplification transistor is arranged in a stage preceding the first amplification transistor and has a second emitter terminal. The mounting substrate has first to fourth ground electrode layers in order of proximity to the first main surface. The first emitter terminal and the second emitter terminal are not electrically connected to each other via an electrode on the first main surface and are not electrically connected to each other via the first ground electrode layer.


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