The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2021
Filed:
Aug. 13, 2019
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Hirokazu Yazaki, Nagaokakyo, JP;
Keito Yonemori, Nagaokakyo, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
An electronic component including a thin-film shield layer includes a wiring substrate, surface mount devices mounted to a first principal surface of the wiring substrate, a metal thin-film shield layer, and a magnetic metal thin-film shield layer. The metal thin-film shield layer includes a nonmagnetic metal material and entirely covers the surface mount devices at the top surface side and lateral surface side thereof. The metal thin-film shield layer includes a top surface portion and a lateral surface portion. The magnetic metal thin-film shield layer includes a magnetic metal material and covers the top surface portion and the lateral surface portion of the metal thin-film shield layer, including an entire edge portion at which the top surface portion and the lateral surface portion are joined to each other.