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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10964642 B1

PDFFull Text
Date of Patent:
Mar. 30, 2021

Filed:

Jan. 23, 2018

Semiconductor module comprising transistor chips, diode chips and driver chips arranged in a common plane

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Juergen Hoegerl, Regensburg, DE;

Andre Arens, Ruethen, DE;

Holger Torwesten, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Dicke, Billig & Czaja, PLLC

Primary Examiner:

Omar F Mojaddedi

Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 23/34 (2006.01); H01L 23/498 (2006.01); H01L 23/373 (2006.01); H01L 25/16 (2006.01); H01L 23/48 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/433 (2006.01); H01L 23/495 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 23/293 (2013.01); H01L 23/3114 (2013.01); H01L 23/3121 (2013.01); H01L 23/34 (2013.01); H01L 23/3735 (2013.01); H01L 23/4334 (2013.01); H01L 23/49861 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 24/48 (2013.01); H01L 24/82 (2013.01); H01L 25/16 (2013.01); H01L 23/49541 (2013.01); H01L 23/49589 (2013.01); H01L 23/50 (2013.01); H01L 24/49 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/14251 (2013.01); H01L 2924/14252 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A semiconductor module is disclosed. In one example, the module includes a carrier, at least one semiconductor transistor disposed on the carrier, at least one semiconductor diode disposed on the carrier, at least one semiconductor driver chip disposed on the carrier, a plurality of external connectors, and an encapsulation layer covering the carrier, the semiconductor transistor, the semiconductor diode, and the semiconductor driver chip. The semiconductor transistor, the semiconductor diode, and the semiconductor driver chip are arranged laterally side by side on the carrier.

Find Patent Forward Citations

Hoegerl, Juergen. (2021). Semiconductor module comprising transistor chips, diode chips and driver chips arranged in a common plane (U.S. Patent No. 10964642). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10964642

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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