The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Jul. 31, 2019
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Takanori Kawashima, Anjo, JP;

Makoto Imai, Toyota, JP;

Masaki Aoshima, Toyota, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/492 (2006.01); H01L 23/00 (2006.01); H01L 29/16 (2006.01); H01L 29/739 (2006.01); H01L 29/861 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 23/492 (2013.01); H01L 23/49531 (2013.01); H01L 23/49562 (2013.01); H01L 24/48 (2013.01); H01L 29/1608 (2013.01); H01L 29/7393 (2013.01); H01L 29/78 (2013.01); H01L 29/861 (2013.01); H01L 2224/48153 (2013.01);
Abstract

A semiconductor device may include a first conductor plate on which a first semiconductor element, a second semiconductor element and a first circuit board are disposed, and a plurality of first signal terminals. A size of the second semiconductor is smaller than a size of the first semiconductor element. In a plan view along a direction perpendicular to the first conductor plate, the plurality of first signal terminals is located in a first direction with respect to the first semiconductor element. The second semiconductor element and the first circuit board are located between the plurality of first signal terminals and the first semiconductor element and are arranged along a second direction that is perpendicular to the first direction. A signal pad of the first semiconductor element is connected to a corresponding one of the plurality of first signal terminals via a signal transmission path of the first circuit board.


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