The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Nov. 26, 2019
Applicant:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Inventors:

Concetto Privitera, Gravina di Catania, IT;

Maurizio Maria Ferrara, Catania, IT;

Fabio Vito Coppone, Tremestieri Etneo, IT;

Assignee:

STMICROELECTRONICS S.R.L., Agrate Brianza, IT;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 23/495 (2006.01); H01L 23/34 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 23/34 (2013.01); H01L 23/49524 (2013.01); H01L 24/83 (2013.01); H01L 2924/173 (2013.01);
Abstract

Packaged semiconductor device having a frame, of conductive material; a body of semiconductor material, fixed to the frame through a first adhesive layer; a heatsink element, fixed to the body through a second adhesive layer; and a packaging mass surrounding the body and, at least partially, the frame and the heatsink element. The heatsink element is formed by a heatsink die facing, and coplanar to, a main face of the device and by a spacer structure, which includes a pair of pedestals projecting from the perimeter of the heatsink die towards the body and rest on the body.


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