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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10964618 B1

PDFFull Text
Date of Patent:
Mar. 30, 2021

Filed:

Aug. 01, 2019

Semiconductor package and method of manufacturing the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jang-woo Lee, Asan-si, KR;

Kyung-suk Oh, Seongnam-si, KR;

Yung-cheol Kong, Cheonan-si, KR;

Woo-hyun Park, Seongnam-si, KR;

Jong-bo Shim, Asan-si, KR;

Jae-myeong Cha, Cheonan-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Muir Patent Law, PLLC

Primary Examiner:

Thinh T Nguyen

Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 25/18 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/565 (2013.01); H01L 23/3185 (2013.01); H01L 23/3738 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/73 (2013.01); H01L 25/18 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01);
Abstract

A semiconductor package includes a first semiconductor chip, a second semiconductor chip attached to an upper surface of the first semiconductor chip, a silicon heat-dissipation body thermally connected to at least one of the first semiconductor chip and the second semiconductor chip, and a molding member configured to surround the first semiconductor chip and the second semiconductor chip and exposing an upper surface of the silicon heat-dissipation body.

Find Patent Forward Citations

Lee, Jang-woo. (2021). Semiconductor package and method of manufacturing the same (U.S. Patent No. 10964618). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10964618

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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