The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

May. 20, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Leon Volfovski, Mountain View, CA (US);

Andreas Schmid, Meyriez, CH;

Denis Martin Koosau, Pleasanton, CA (US);

Nicholas Michael Kopec, Santa Clara, CA (US);

Steven Babayan, Los Altos, CA (US);

Douglas R. McAllister, San Ramon, CA (US);

Helder Lee, San Jose, CA (US);

Jeffrey Hudgens, San Francisco, CA (US);

Damon K. Cox, Jarrell, TX (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); H01L 21/687 (2006.01); H01L 21/683 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68735 (2013.01); H01L 21/68 (2013.01); H01L 21/6838 (2013.01); H01L 21/68707 (2013.01); H01L 21/68721 (2013.01); H01L 21/68742 (2013.01); H01L 21/677 (2013.01);
Abstract

A process kit ring adaptor includes a rigid carrier. The rigid carrier includes an upper surface and a lower surface. The upper surface includes a first distal portion and a second distal portion to support a process kit ring. The lower surface includes a first region to interface with an end effector configured to support wafers and a solid planar central region to interface with a vacuum chuck.


Find Patent Forward Citations

Loading…