The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2021
Filed:
Apr. 24, 2018
Applicant:
Okamoto Machine Tool Works, Ltd., Gunma, JP;
Inventors:
Eiichi Yamamoto, Gunma, JP;
Yoshihiro Terakubo, Gunma, JP;
Takahiko Mitsui, Gunma, JP;
Toshihiro Ito, Gunma, JP;
Assignee:
OKAMOTO MACHINE TOOL WORKS, LTD., Gunma, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 41/06 (2012.01); H01L 21/683 (2006.01); H01L 21/304 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); B24B 41/06 (2013.01); H01L 21/304 (2013.01); H01L 21/67092 (2013.01); H01L 21/6835 (2013.01); H01L 21/68757 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01);
Abstract
An electrostatic attachment chuck includes: a substrate; a synthetic resin sheet joined to one main surface of the substrate; and at least a pair of electrodes disposed in the synthetic resin sheet. The synthetic resin sheet includes a planarized and ground surface serving as a surface on which a semiconductor wafer is abutted.