The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2021
Filed:
Sep. 26, 2018
Applicant:
Matrics2, Inc., Warba, MN (US);
Inventors:
Michael R. Arneson, Warba, MN (US);
William R. Bandy, Gambrills, MD (US);
Assignee:
Matrics2, Inc., Warba, MN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67092 (2013.01); H01L 21/67132 (2013.01); H01L 21/67144 (2013.01); H01L 21/6835 (2013.01); H01L 24/75 (2013.01); H01L 24/95 (2013.01); H01L 23/544 (2013.01); H01L 2221/68313 (2013.01); H01L 2223/5444 (2013.01); H01L 2224/75 (2013.01); H01L 2924/13063 (2013.01); H01L 2924/13091 (2013.01);
Abstract
Methods, systems, and apparatuses are described for integrated circuit controlled ejection system (ICCES) for massively parallel integrated circuit assembly (MPICA). A unique Integrated Circuit (IC) die ejection head assembly system is described, which utilizes Three-Dimensional (3D) printing to achieve very high resolution manufacturing to meet the precision tolerances required for very small IC die sizes.