The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2021
Filed:
Jan. 27, 2020
Applicant:
Qromis, Inc., Santa Clara, CA (US);
Inventors:
Vladimir Odnoblyudov, Danville, CA (US);
Cem Basceri, Los Gatos, CA (US);
Shari Farrens, Boise, ID (US);
Assignee:
QROMIS, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C30B 29/40 (2006.01); C30B 29/06 (2006.01); C23C 16/56 (2006.01); C23C 16/50 (2006.01); C23C 16/40 (2006.01); H01L 33/02 (2010.01); H01L 27/12 (2006.01); H01L 21/84 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 21/0242 (2013.01); C23C 16/401 (2013.01); C23C 16/50 (2013.01); C23C 16/56 (2013.01); C30B 29/06 (2013.01); C30B 29/406 (2013.01); H01L 21/0243 (2013.01); H01L 21/0245 (2013.01); H01L 21/0254 (2013.01); H01L 21/02516 (2013.01); H01L 21/02532 (2013.01); H01L 21/84 (2013.01); H01L 27/12 (2013.01); H01L 33/0075 (2013.01); H01L 33/02 (2013.01);
Abstract
A method of fabricating a ceramic substrate structure includes providing a ceramic substrate, encapsulating the ceramic substrate in a barrier layer, and forming a bonding layer coupled to the barrier layer. The method further includes removing a portion of the bonding layer to expose at least a portion of the barrier layer and define fill regions, and depositing a second bonding layer on the at least a portion of the exposed barrier layer and the fill regions.