The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2021
Filed:
Apr. 07, 2017
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Tsuyoshi Osaga, Tokyo, JP;
Yasuo Ata, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/683 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02013 (2013.01); H01L 21/6836 (2013.01); H01L 21/76862 (2013.01);
Abstract
A back surface of a wafer is formed with a ring-shaped projecting portion. The wafer is cut with a blade from a side of a front surface of the wafer in a state where the projecting portion of the wafer with a back surface facing upward is supported.
Osaga, Tsuyoshi. (2021). Semiconductor manufacturing method for cutting a wafer (U.S. Patent No. 10964524). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10964524
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile