The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Jul. 24, 2014
Applicant:

Daikin Industries, Ltd., Osaka, JP;

Inventors:

Yuki Ueda, Settsu, JP;

Masami Nishiumi, Settsu, JP;

Haruhisa Masuda, Settsu, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 27/18 (2006.01); H01B 3/30 (2006.01); H01B 3/44 (2006.01); H01B 3/42 (2006.01); C09D 127/18 (2006.01); C09D 171/00 (2006.01); C08L 71/00 (2006.01);
U.S. Cl.
CPC ...
H01B 3/30 (2013.01); C08L 27/18 (2013.01); C08L 71/00 (2013.01); C09D 127/18 (2013.01); C09D 171/00 (2013.01); H01B 3/307 (2013.01); H01B 3/427 (2013.01); H01B 3/442 (2013.01); H01B 3/445 (2013.01); C08G 2650/40 (2013.01); C08L 2203/202 (2013.01);
Abstract

The present invention aims to provide a resin composition which can provide a molded article excellent in insulation and showing a low relative permittivity and which causes no melt fracture even when extrusion-molded at a high shear rate. The resin composition of the present invention includes an aromatic polyether ketone resin (I) and a fluororesin (II). The fluororesin (II) is a copolymer of tetrafluoroethylene and a perfluoro ethylenically unsaturated compound represented by the following formula (1):CF═CF—Rf  (1)wherein Rfrepresents —CFor —ORf; and Rfrepresents a C1-C5 perfluoroalkyl group. The aromatic polyether ketone resin (I) and the fluororesin (II) satisfy a melt viscosity ratio (I)/(II) of not lower than 0.001 but lower than 0.3.


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