The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Feb. 10, 2017
Applicant:

Dexerials Corporation, Tokyo, JP;

Inventors:

Shinichi Hayashi, Utsunomiya, JP;

Kenji Tokuhisa, Tokyo, JP;

Etsuko Yamaguchi, Oyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); H01B 5/16 (2006.01); C08G 59/24 (2006.01); C08G 59/40 (2006.01); C08K 3/08 (2006.01); C08K 5/19 (2006.01); C08L 63/00 (2006.01); C08L 71/08 (2006.01); C08J 5/18 (2006.01); C08G 59/68 (2006.01); H01L 23/00 (2006.01); C08L 71/00 (2006.01); C08G 65/18 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); C08G 59/24 (2013.01); C08G 59/245 (2013.01); C08G 59/4014 (2013.01); C08G 59/4064 (2013.01); C08G 59/686 (2013.01); C08G 59/687 (2013.01); C08G 65/18 (2013.01); C08J 5/18 (2013.01); C08K 3/08 (2013.01); C08K 5/19 (2013.01); C08L 63/00 (2013.01); C08L 71/00 (2013.01); C08L 71/08 (2013.01); H01B 5/16 (2013.01); H01L 24/00 (2013.01); H01L 24/29 (2013.01); C08G 2650/56 (2013.01); C08K 2003/085 (2013.01); C08K 2003/0831 (2013.01); C08K 2003/0843 (2013.01); C08K 2003/0862 (2013.01); C08K 2201/001 (2013.01); C08L 2203/16 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/294 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29301 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29357 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29391 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/8585 (2013.01); H01L 2924/14 (2013.01);
Abstract

A cationically polymerizable anisotropic conductive film is provided. The cationically polymerizable anisotropic conductive film includes an alicyclic epoxy compound and achieves storage life property better than known anisotropic conductive films while ensuring curing temperature and connection reliability equivalent to known anisotropic conductive films. The anisotropic conductive film contains a binder composition containing a film forming component and a cationically polymerizable component, a cationic polymerization initiator, and conductive particles. The anisotropic conductive film contains a quaternary ammonium salt-based thermal acid generator as a cationic polymerization initiator and an alicyclic epoxy compound and a low polarity oxetane compound as a cationically polymerizable component.


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