The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Apr. 12, 2018
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventors:

Hiroaki Ono, Kanagawa, JP;

Tomonori Masuno, Kanagawa, JP;

Shun Li, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06T 7/62 (2017.01); G06T 7/50 (2017.01); H04N 5/232 (2006.01); G01B 11/02 (2006.01); G01B 11/22 (2006.01);
U.S. Cl.
CPC ...
G06T 7/62 (2017.01); G01B 11/02 (2013.01); G01B 11/22 (2013.01); G06T 7/50 (2017.01); H04N 5/232939 (2018.08); G06T 2207/10028 (2013.01);
Abstract

It is desired to provide technology that enables automatic measurement of the size of a subject with a reduced number of frames of images required, relaxed restrictions on the coverage and light projection, and no limitation on the shape of the subject. Provided is an information processing device including: a depth information acquiring unit configured to acquire depth information; a data conversion unit configured to convert the depth information into three-dimensional data; a subject extraction unit configured to extract a subject area where a subject is present on the basis of the three-dimensional data; and a size measurement unit configured to measure a size of the subject on the basis of the subject area, in which the size measurement unit detects six planes circumscribing the subject area and measures the size of the subject on the basis of the six planes.


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