The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Aug. 29, 2016
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Timothy C. Shaw, Austin, TX (US);

Jim Tom Belesiu, Kirkland, WA (US);

Paul Henry Dietz, Redmond, WA (US);

Christopher Harry Stoumbos, Sammamish, WA (US);

Dennis J. Mathias, Kenmore, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H 13/70 (2006.01); H01H 13/702 (2006.01); H01H 13/703 (2006.01); H01H 13/78 (2006.01); G06F 3/041 (2006.01); G06F 1/16 (2006.01); H04M 1/02 (2006.01); G06F 3/02 (2006.01); H04M 1/72409 (2021.01); H05K 5/02 (2006.01); G06F 3/023 (2006.01); E05D 11/10 (2006.01); E05F 5/08 (2006.01); F16M 11/38 (2006.01); G06F 13/10 (2006.01); H01H 11/00 (2006.01); H01H 13/807 (2006.01); H01H 13/82 (2006.01); G06F 3/0488 (2013.01); H01H 9/26 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0414 (2013.01); E05D 11/1064 (2013.01); E05F 5/08 (2013.01); F16M 11/38 (2013.01); G06F 1/166 (2013.01); G06F 1/1616 (2013.01); G06F 1/1618 (2013.01); G06F 1/1637 (2013.01); G06F 1/1654 (2013.01); G06F 1/1656 (2013.01); G06F 1/1662 (2013.01); G06F 1/1669 (2013.01); G06F 1/1681 (2013.01); G06F 1/1684 (2013.01); G06F 3/02 (2013.01); G06F 3/0202 (2013.01); G06F 3/023 (2013.01); G06F 3/0219 (2013.01); G06F 3/0416 (2013.01); G06F 3/04886 (2013.01); G06F 13/102 (2013.01); H01H 11/00 (2013.01); H01H 13/807 (2013.01); H01H 13/82 (2013.01); H04M 1/0216 (2013.01); H04M 1/0254 (2013.01); H04M 1/72409 (2021.01); H05K 5/0226 (2013.01); H05K 5/0234 (2013.01); H01H 9/26 (2013.01); H01H 2201/036 (2013.01); H01H 2203/02 (2013.01); H01H 2203/036 (2013.01); H01H 2203/058 (2013.01); H01H 2205/006 (2013.01); H01H 2211/004 (2013.01); H01H 2211/006 (2013.01); H01H 2213/016 (2013.01); H01H 2217/006 (2013.01); H01H 2227/032 (2013.01); H04M 1/0245 (2013.01); Y02D 10/00 (2018.01); Y10T 16/5401 (2015.01); Y10T 16/551 (2015.01); Y10T 29/49826 (2015.01);
Abstract

Pressure sensitive key techniques are described. In one or more implementations, a device includes at least one pressure sensitive key having a flexible contact layer spaced apart from a sensor substrate by a spacer layer, the flexible contact layer configured to flex responsive to pressure to contact the sensor substrate to initiate an input, for a computing device, associated with the pressure sensitive key. At least one of the flexible contact layer or the sensor substrate are configured to at least partially normalize an output resulting from pressure applied at a first location of the flexible contact layer with an output resulting from pressure applied at a second location of the flexible contact layer that has lesser flexibility than the first location.


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