The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Jan. 03, 2019
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Joseph Michael Luizzi, Sammamish, WA (US);

Seungwoo Lee, Bothell, WA (US);

Utku Baran, Seattle, WA (US);

Michael James Nystrom, Mercer Island, WA (US);

Robert J. Dyer, Everett, WA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 26/08 (2006.01); G02B 26/10 (2006.01); B81C 3/00 (2006.01); G02B 27/01 (2006.01);
U.S. Cl.
CPC ...
G02B 26/0858 (2013.01); B81C 3/001 (2013.01); G02B 26/101 (2013.01); G02B 27/0176 (2013.01); B81C 2203/032 (2013.01); G02B 2027/0154 (2013.01);
Abstract

A micro electro mechanical system is provided. The micro electro mechanical system includes a first part bonded to a second part by a structural adhesive interface. The structural adhesive interface includes a conductive structural adhesive portion, and a non-conductive structural adhesive portion at least partially surrounding the conductive structural adhesive portion. The conductive structural adhesive portion and the non-conductive structural adhesive portion have a thixotropy index greater than one.


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