The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Feb. 05, 2019
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Takuma Tsuchiya, Kariya, JP;

Junzo Yamaguchi, Kariya, JP;

Takashi Enomoto, Kariya, JP;

Hiroyuki Akuzawa, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01D 11/24 (2006.01); G01F 1/684 (2006.01); G01M 15/02 (2006.01); G01N 27/22 (2006.01); F02D 41/18 (2006.01);
U.S. Cl.
CPC ...
G01D 11/245 (2013.01); F02D 41/18 (2013.01); G01F 1/684 (2013.01); G01M 15/02 (2013.01); G01N 27/223 (2013.01);
Abstract

A sensor body contains a sensor element in a body recess opened at a body opening. A sensor substrate has a mounting surface on which a circuit element for processing a detection signal is mounted and holds the sensor body on the mounting surface. A sensor cover has a cover window penetrating between an intake passage and the body opening and covers the sensor body. A sensor filter is interposed between the sensor body and the sensor cover. A potting resin body is cured on the mounting surface so as to seal the circuit element. The sensor cover is embedded in the potting resin body on the outer peripheral side of the sensor body.


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