The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Nov. 09, 2018
Applicant:

Ldc Precision Engineering Co., Ltd., New Taipei, TW;

Inventors:

Chi-Feng Hsu, New Taipei, TW;

Cheng-Jen Liang, New Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/02 (2006.01); F28D 21/00 (2006.01); H01L 23/427 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
F28D 15/0266 (2013.01); F28D 2021/0064 (2013.01); H01L 23/427 (2013.01); H05K 7/20309 (2013.01);
Abstract

An evaporator structure with improved layout of cooling fluid channels includes a heat exchange component, a thermal conductive shell and a top cap. The heat exchange component is accommodated in the thermal conductive shell; the top cap mounted on the thermal conductive shell encloses the heat exchange component; the heat exchange component includes a plurality of transverse channels thereon, two first lengthwise cooling fluid channels near two side edges at the bottom respectively and a plurality of minor second lengthwise cooling fluid channels near the center. When the thermal conductive shell is heated, cooling fluids flowing to first lengthwise cooling fluid channels at both sides through transverse channels are guided into second lengthwise cooling fluid channels via the first lengthwise cooling fluid channels and the transverse channels and distributed throughout heat sources uniformly for full-area heat dissipation.


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