logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10962267 B1

PDFFull Text
Date of Patent:
Mar. 30, 2021

Filed:

Sep. 08, 2016

Heat pump apparatus

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Yasuhiro Suzuki, Tokyo, JP;

Hirokazu Minamisako, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorney:

Posz Law Group, PLC

Primary Examiner:

Nelson J Nieves

Int. Cl.
CPC ...
F25B 49/02 (2006.01); F24F 1/14 (2011.01); F24F 1/26 (2011.01); F25B 30/02 (2006.01); F25B 47/02 (2006.01); F25B 25/00 (2006.01); F24F 140/10 (2018.01); F24H 4/02 (2006.01); F24H 9/20 (2006.01);
U.S. Cl.
CPC ...
F25B 49/02 (2013.01); F24F 1/14 (2013.01); F24F 1/26 (2013.01); F24H 4/02 (2013.01); F24H 9/2007 (2013.01); F25B 25/005 (2013.01); F25B 30/02 (2013.01); F25B 47/025 (2013.01); F24F 2140/10 (2018.01); F25B 2339/047 (2013.01); F25B 2400/12 (2013.01); F25B 2600/2525 (2013.01);
Abstract

A heat pump apparatus includes: a refrigerant circuit configured to circulate refrigerant having flammability; a heat medium circuit configured to allow a heat medium to flow therethrough; a heat-medium heat exchanger configured to exchange heat between the refrigerant and the heat medium; an outdoor unit configured to accommodate the refrigerant circuit and the heat-medium heat exchanger; and an indoor unit configured to accommodate a part of the heat medium circuit, the outdoor unit including a refrigerant release valve, the refrigerant release valve being at least one of a pressure relief valve and an air purge valve which are provided in the heat medium circuit, the refrigerant release valve being provided outside a casing of the outdoor unit.

Find Patent Forward Citations

Suzuki, Yasuhiro. (2021). Heat pump apparatus (U.S. Patent No. 10962267). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10962267

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…