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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10961419 B1

PDFFull Text
Date of Patent:
Mar. 30, 2021

Filed:

Oct. 26, 2017

Layered body and method for manufacturing electronic component

Applicant:

Dow Toray Co., Ltd., Tokyo, JP;

Inventors:

Hiroshi Fukui, Ichihara, JP;

Kyoko Toyama, Ichihara, JP;

Yoshito Ushio, Ichihara, JP;

Assignee:

DOW TORAY CO., LTD., Tokyo, JP;

Attorney:

Warner Norcross + Judd LLP

Primary Examiner:

Philip C Tucker

Assistant Examiner:

Brian R Slawski

Int. Cl.
CPC ...
C09J 183/04 (2006.01); B32B 7/02 (2019.01); B32B 7/12 (2006.01); B32B 27/00 (2006.01); C08J 7/04 (2020.01); B32B 7/025 (2019.01); B32B 27/08 (2006.01); B29C 65/00 (2006.01); B32B 7/022 (2019.01); B29C 65/76 (2006.01); B29C 65/48 (2006.01); B32B 27/16 (2006.01); B32B 27/28 (2006.01);
U.S. Cl.
CPC ...
C09J 183/04 (2013.01); B32B 7/02 (2013.01); B32B 7/12 (2013.01); B32B 27/00 (2013.01); C08J 7/042 (2013.01); B29C 65/483 (2013.01); B29C 65/486 (2013.01); B29C 65/4855 (2013.01); B29C 65/76 (2013.01); B29C 66/41 (2013.01); B32B 7/022 (2019.01); B32B 7/025 (2019.01); B32B 27/08 (2013.01); B32B 27/16 (2013.01); B32B 27/283 (2013.01);
Abstract

Provided is a laminate having a gel layer on a substrate able to protect the substrate during various types of processing used in industrial production steps prior to curing. The gel layer has excellent heat resistance, softness and flexibility, a low modulus of elasticity, low stress, excellent stress buffering properties, and electronic component retention properties. The gel layer has higher shape retention before curing but changing after curing into a hard layer having excellent release properties. The laminate is easily and readily releasable from the substrate even when the cured layer is localized. Applications thereof are also provided (such as an electronic component manufacturing method). The laminate comprises a laminated reaction-curable silicone gel and a sheet-like member laminated via an adhesive layer on top of the reaction-curable silicone gel.

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