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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10961411 B1

PDFFull Text
Date of Patent:
Mar. 30, 2021

Filed:

Nov. 30, 2018

Inkjet adhesive, manufacturing method for semiconductor device, and electronic component

Applicant:

Sekisui Chemical Co., Ltd., Osaka, JP;

Inventors:

Mitsuru Tanikawa, Osaka, JP;

Takashi Watanabe, Osaka, JP;

Yusuke Fujita, Osaka, JP;

Yoshito Fujita, Osaka, JP;

Tasuku Yamada, Osaka, JP;

Assignee:

SEKISUI CHEMICAL CO., LTD., Osaka, JP;

Attorney:

Cheng Law Group, PLLC

Primary Examiner:

Victor A Mandala

Assistant Examiner:

Colleen E Snow

Int. Cl.
CPC ...
H01L 23/48 (2006.01); C09D 133/14 (2006.01); C09J 163/00 (2006.01); C09J 201/02 (2006.01); H01L 21/52 (2006.01); C08G 59/42 (2006.01); C08G 59/68 (2006.01); C08G 59/50 (2006.01); C08L 33/08 (2006.01); C09J 4/06 (2006.01); H01L 23/00 (2006.01); C09J 5/06 (2006.01); C09J 171/12 (2006.01); C09D 11/101 (2014.01); C09D 11/107 (2014.01); C09D 11/30 (2014.01); C09D 11/52 (2014.01); C09D 133/10 (2006.01); C09J 5/04 (2006.01); C09J 9/02 (2006.01); C09J 133/10 (2006.01); C09J 133/14 (2006.01);
U.S. Cl.
CPC ...
C09D 133/14 (2013.01); C08G 59/4215 (2013.01); C08G 59/5033 (2013.01); C08G 59/686 (2013.01); C08L 33/08 (2013.01); C09D 11/101 (2013.01); C09D 11/107 (2013.01); C09D 11/30 (2013.01); C09D 11/52 (2013.01); C09D 133/10 (2013.01); C09J 4/06 (2013.01); C09J 5/04 (2013.01); C09J 5/06 (2013.01); C09J 9/02 (2013.01); C09J 133/10 (2013.01); C09J 133/14 (2013.01); C09J 163/00 (2013.01); C09J 171/12 (2013.01); C09J 201/02 (2013.01); H01L 21/52 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/48 (2013.01); H01L 24/83 (2013.01); H01L 24/91 (2013.01); C09J 2203/326 (2013.01); C09J 2301/414 (2020.08); C09J 2301/416 (2020.08); C09J 2433/00 (2013.01); C09J 2461/00 (2013.01); C09J 2463/00 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/2741 (2013.01); H01L 2224/2783 (2013.01); H01L 2224/27318 (2013.01); H01L 2224/27515 (2013.01); H01L 2224/27848 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29083 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8322 (2013.01); H01L 2224/83026 (2013.01); H01L 2224/83359 (2013.01); H01L 2224/83856 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/83947 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06565 (2013.01); H01L 2924/00014 (2013.01);
Abstract

Provided is an inkjet adhesive which is applied using an inkjet device, wherein the adhesive can suppress generation of voids in the adhesive layer and, after bonding, can enhance adhesiveness, moisture-resistant adhesion reliability, and cooling/heating cycle reliability. An inkjet adhesive according to the present invention comprises a photocurable compound, a photo-radical initiator, a thermosetting compound having one or more cyclic ether groups or cyclic thioether groups, and a compound capable of reacting with the thermosetting compound, and the compound capable of reacting with the thermosetting compound contains aromatic amine.

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