The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2021
Filed:
Jan. 08, 2015
Applicant:
Komatsu Matere Co., Ltd., Ishikawa, JP;
Inventors:
Yutaka Hayashi, Ishikawa, JP;
Taketoshi Nakayama, Ishikawa, JP;
Hiroyuki Yamada, Ishikawa, JP;
Honami Noda, Ishikawa, JP;
Assignee:
KOMATSU MATERE CO., LTD., Ishikawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/04 (2006.01); C08J 5/24 (2006.01);
U.S. Cl.
CPC ...
C08J 5/042 (2013.01); C08J 5/24 (2013.01); C08J 2363/00 (2013.01);
Abstract
A fiber-reinforced resin material includes a thermoplastic resin and a bundle of reinforced fibers arranged in one direction, the thermoplastic resin being a reactive resin. The thermoplastic resin may be an epoxy resin. The reinforced fibers may be carbon fibers. A molded fiber-reinforced resin body is obtained using the fiber-reinforced resin material. The molded fiber-reinforced resin body may be formed by the application of heat and pressure.