The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

May. 29, 2017
Applicant:

Borealis Ag, Vienna, AT;

Inventors:

Yi Liu, Engerwitzdorf, AT;

Victor Sumerin, Helsinki, FI;

Ravindra Tupe, Porvoo, FI;

Assignee:

BOREALIS AG, Vienna, AT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 210/16 (2006.01); C08F 4/649 (2006.01); C08F 4/655 (2006.01); C08F 4/659 (2006.01); C08L 23/08 (2006.01); C08L 23/04 (2006.01);
U.S. Cl.
CPC ...
C08F 210/16 (2013.01); C08F 4/6494 (2013.01); C08F 4/6555 (2013.01); C08F 4/65916 (2013.01); C08L 23/0807 (2013.01); C08L 23/0815 (2013.01); C08F 2500/12 (2013.01); C08L 2203/18 (2013.01); C08L 2205/025 (2013.01); C08L 2308/00 (2013.01);
Abstract

A polyethylene composition comprising a base resin is disclosed herein. The base resin includes an ethylene homo- or copolymer fraction (A1), and an ethylene homo- or copolymer fraction (A2). Fraction (A1) has a lower weight average molecular weight than fraction (A2). The base resin has a melt flow rate MFRof equal to or less than 8.0 g/10 min and a density of 930 to 950 kg/m3. The polyethylene composition has a melt flow rate MFRof 0.01 to 0.3 g/10 min, a flow rate ratio FRRof equal to or more than 20 and a ratio of the weight average molecular weight and the number average molecular weight (M/M) of equal to or less than 30. Also the polyethylene composition has a tensile modulus of less than 1000 MPa. Also a process for the production of a polyethylene composition comprising polyethylene base resin is disclosed herein.


Find Patent Forward Citations

Loading…