The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2021
Filed:
Aug. 26, 2019
Applicant:
Hayashi Telempu Corporation, Nagoya, JP;
Inventor:
Hiromichi Miyano, Aichi, JP;
Assignee:
HAYASHI TELEMPU CORPORATION, Nagoya, JP;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 27/12 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); B32B 27/32 (2006.01); B62D 25/20 (2006.01); B60R 13/08 (2006.01);
U.S. Cl.
CPC ...
B32B 27/12 (2013.01); B32B 5/022 (2013.01); B32B 5/26 (2013.01); B32B 27/32 (2013.01); B62D 25/2072 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/0284 (2013.01); B32B 2262/101 (2013.01); B32B 2307/10 (2013.01); B32B 2307/724 (2013.01); B32B 2605/00 (2013.01); B32B 2605/08 (2013.01); B60R 13/0861 (2013.01); Y10T 428/24 (2015.01); Y10T 428/249921 (2015.04); Y10T 428/249962 (2015.04); Y10T 428/27 (2015.01);
Abstract
The present invention discloses an integrally molded vehicular undercover having air permeability includes a base material layer containing inorganic fibers and a first solidified thermoplastic binder, the base material layer having a road side surface and a vehicle body side surface, an outer layer containing synthetic resin fibers and a second solidified thermoplastic binder, the outer layer being integrated with the road side surface of the base material layer, and a synthetic resin layer having air permeability, the synthetic resin layer being integrated with the vehicle body side surface of the base material layer.