The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Feb. 23, 2018
Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Shinichi Ohara, Tokyo, JP;

Kiyokazu Umetsu, Tokyo, JP;

Ryoji Kimura, Tokyo, JP;

Tomoo Okubo, Tokyo, JP;

Kenichi Shimamura, Tokyo, JP;

Kohei Nakane, Tokyo, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 175/04 (2006.01); B32B 7/12 (2006.01); B32B 9/00 (2006.01); B32B 15/20 (2006.01); C08G 18/62 (2006.01); C08G 18/76 (2006.01); C08G 18/42 (2006.01); C08G 18/40 (2006.01); C09J 125/02 (2006.01); C09J 135/06 (2006.01); B32B 27/40 (2006.01); B32B 15/095 (2006.01);
U.S. Cl.
CPC ...
B32B 7/12 (2013.01); B32B 9/005 (2013.01); B32B 15/095 (2013.01); B32B 15/20 (2013.01); B32B 27/40 (2013.01); C09J 125/02 (2013.01); C09J 135/06 (2013.01); C09J 175/04 (2013.01); B32B 2553/00 (2013.01);
Abstract

Provided is a solvent-free-adhesive polyisocyanate composition, containing, a polyisocyanate (A) and an aromatic vinyl-maleic anhydride copolymer (B), which is a copolymer of aromatic vinyl and maleic anhydride in which a molar ratio [aromatic vinyl/maleic anhydride] of the raw material monomers of the copolymer is 1.5/1 to 5/1. Further provided is a method for producing the polyisocyanate composition; a solvent-free adhesive containing, the solvent-free-adhesive polyisocyanate composition and a polyol (Y); and a multilayer film obtained by laminating a first base material film, a second base material film, and an adhesive layer between the base material films, in which the adhesive layer is formed of the solvent-free adhesive.


Find Patent Forward Citations

Loading…