The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Jul. 22, 2016
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Anna Tarradas, Sant Cugat del Valles, ES;

Xavier Vilajosana, Sant Cugat del Valles, ES;

Diego Javier Mostaccio, Sant Cugat del Valles, ES;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/393 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B29C 64/295 (2017.01); B29C 35/02 (2006.01); B22F 3/00 (2021.01); B28B 1/00 (2006.01); B28B 17/00 (2006.01);
U.S. Cl.
CPC ...
B29C 64/393 (2017.08); B22F 3/008 (2013.01); B28B 1/001 (2013.01); B28B 17/0081 (2013.01); B29C 35/0288 (2013.01); B29C 64/295 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12);
Abstract

According to some examples, a method comprises measuring, using a detector, a temperature of at least a portion of a layer of build material formed on a print bed associated with an additive manufacturing apparatus. The additive manufacturing apparatus may include a heating module to direct heat towards successive layers of build material during a series of successive passes over the build material. The method may further comprise determining, using a processor, based at least in part on the measured temperature, a duration that the heating module is to wait before performing a pass over the build material, and a speed at which the heating module is to travel over the build material.


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