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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10960599 B1

PDFFull Text
Date of Patent:
Mar. 30, 2021

Filed:

Jun. 10, 2016

Method of manufacturing gasket

Applicant:

Nok Corporation, Tokyo, JP;

Inventors:

Satomi Yoshida, Fujisawa, JP;

Takahiro Hayashi, Fujisawa, JP;

Assignee:

NOK CORPORATION;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Alison L Hindenlang

Assistant Examiner:

Olukorede Esan

Int. Cl.
CPC ...
B29C 59/02 (2006.01); B29C 35/08 (2006.01); B29C 33/00 (2006.01); B29C 37/02 (2006.01); B29C 43/38 (2006.01); B29C 43/18 (2006.01); F16J 15/10 (2006.01); H01M 8/0284 (2016.01); H01M 8/0276 (2016.01); F16J 15/12 (2006.01); H01M 8/0286 (2016.01); F16J 15/14 (2006.01); B29L 31/26 (2006.01); B29L 31/34 (2006.01); H01M 8/0273 (2016.01);
U.S. Cl.
CPC ...
B29C 59/026 (2013.01); B29C 33/0055 (2013.01); B29C 35/0805 (2013.01); B29C 37/02 (2013.01); B29C 43/18 (2013.01); B29C 43/38 (2013.01); F16J 15/102 (2013.01); F16J 15/108 (2013.01); F16J 15/123 (2013.01); F16J 15/14 (2013.01); H01M 8/0276 (2013.01); H01M 8/0284 (2013.01); H01M 8/0286 (2013.01); B29C 35/0888 (2013.01); B29C 2035/0827 (2013.01); B29L 2031/265 (2013.01); B29L 2031/3468 (2013.01); H01M 8/0273 (2013.01); Y02P 70/50 (2015.11);
Abstract

A process for producing gaskets by curing a liquid molding material applied over a plate by a dispenser, wherein in order to improve accuracy in the cross-sectional shape and/or height of the gaskets, the process comprises the steps of: using a dispenser to coat the upper surface of a plate with a liquid molding material, and form a coating layer extending endlessly in a prescribed pattern; and overlapping a molding jig on the plate, the molding jig having in a lower surface a molding groove extending endlessly in a prescribed pattern corresponding to the coating layer, correcting the cross-sectional shape of the coating layer to a cross-sectional shape that corresponds to the molding groove, and curing the coating layer.

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