The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Sep. 16, 2016
Applicants:

Heraeus Materials Singapore Pte., Ltd., Techplace II, SG;

Heraeus Oriental Hitec Co., Ltd., Incheon, KR;

Inventors:

Il Tae Kang, Kunsan, KR;

Yong-Deok Tark, Incheon, KR;

Mong Hyun Cho, Incheon, KR;

Jong Su Kim, Incheon, KR;

Hyun Seok Jung, Incheon, KR;

Tae Yeop Kim, Seoul, KR;

Xi Zhang, Thomson, SG;

Murali Sarangapani, Singapore, SG;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 35/30 (2006.01); B23K 35/02 (2006.01); C22C 5/06 (2006.01); H01L 23/00 (2006.01); C25D 5/12 (2006.01); C25D 5/50 (2006.01); C25D 7/06 (2006.01); C25D 5/10 (2006.01); C23C 28/02 (2006.01); B23K 20/00 (2006.01); C22F 1/00 (2006.01); C22F 1/02 (2006.01); C22F 1/14 (2006.01); C22C 5/08 (2006.01); B23K 35/40 (2006.01); C23C 14/02 (2006.01); C23C 14/16 (2006.01);
U.S. Cl.
CPC ...
B23K 35/3006 (2013.01); B23K 20/007 (2013.01); B23K 35/0227 (2013.01); B23K 35/0261 (2013.01); B23K 35/404 (2013.01); C22C 5/06 (2013.01); C22C 5/08 (2013.01); C22F 1/002 (2013.01); C22F 1/02 (2013.01); C22F 1/14 (2013.01); C23C 14/022 (2013.01); C23C 14/165 (2013.01); C23C 28/021 (2013.01); C25D 5/10 (2013.01); C25D 5/12 (2013.01); C25D 5/50 (2013.01); C25D 7/0607 (2013.01); H01L 24/42 (2013.01); H01L 24/43 (2013.01); H01L 24/44 (2013.01); H01L 24/45 (2013.01); H01L 24/85 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/43125 (2013.01); H01L 2224/43848 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45016 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45164 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/45572 (2013.01); H01L 2224/45644 (2013.01); H01L 2224/45655 (2013.01); H01L 2224/45664 (2013.01); H01L 2224/48511 (2013.01); H01L 2224/85045 (2013.01); H01L 2224/85205 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01044 (2013.01); H01L 2924/01045 (2013.01); H01L 2924/01078 (2013.01);
Abstract

A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core includes: (a) pure silver consisting of silver and further components; or (b) doped silver consisting of silver, at least one doping element, and further components; or (c) a silver alloy consisting of silver, palladium and further components; or (d) a silver alloy consisting of silver, palladium, gold, and further components; or (e) a doped silver alloy consisting of silver, palladium, gold, at least one doping element, and further components, wherein the individual amount of any further component is less than 30 wt.-ppm and the individual amount of any doping element is at least 30 wt.-ppm, and the coating layer is a single-layer of gold or palladium or a double-layer comprised of an inner layer of nickel or palladium and an adjacent outer layer of gold.


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