The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2021
Filed:
Nov. 24, 2016
Hesse Gmbh, Paderborn, DE;
Matthias Hunstig, Paderborn, DE;
Michael Broekelmann, Delbrueck, DE;
Hesse GmbH, Paderborn, DE;
Abstract
A method for operating an ultrasonic wire bonder. The ultrasonic wire bonder has a bonding head with a bonding tool and with a transducer for exciting ultrasonic vibrations in the bonding tool and a controller () for the transducer (). In a first process phase I a bonding wire is bonded to a substrate. The bonding wire is pressed against the substrate with a bonding force via a tool tip of the bonding tool, and the bonding tool is then excited so as to undergo ultrasonic vibrations in order to produce a bond between the bonding wire and the substrate, the transducer () being excited so as to vibrate for a specified or variable bonding time. In a second process phase II, the actuation of the transducer () is changed and reverberations of the bonding tool are counteracted, the transducer () being operated in a damped manner.