The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Dec. 10, 2018
Applicant:

Dalian University of Technology, Dalian, CN;

Inventors:

Shijian Yuan, Dalian, CN;

Xiaobo Fan, Dalian, CN;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B21D 26/045 (2011.01); B21D 26/041 (2011.01); C22C 21/08 (2006.01); C22C 21/10 (2006.01); C22C 21/12 (2006.01); B21D 26/033 (2011.01); B21D 26/053 (2011.01);
U.S. Cl.
CPC ...
B21D 26/045 (2013.01); B21D 26/033 (2013.01); B21D 26/041 (2013.01); B21D 26/053 (2013.01); C22C 21/08 (2013.01); C22C 21/10 (2013.01); C22C 21/12 (2013.01);
Abstract

The present invention discloses a method for pressure forming of an aluminum alloy special-shaped tubular component by using an ultra-low temperature medium. By means of the characteristics that the forming property of an aluminum alloy tube is greatly improved under ultra-low temperature conditions, a tube is cooled and pressurized in a die through an ultra-low temperature medium, so that the tube forms a special-shaped tubular component at an ultra-low temperature. In the method for pressure forming of an aluminum alloy special-shaped tubular component by using an ultra-low temperature medium, the ultra-low temperature medium is not only used for cooling the die and the tube, but also used for pressurization to achieve flexible loading of the tube, which is favorable for forming complex special-shaped tubular components with varied cross-sections.


Find Patent Forward Citations

Loading…