The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2021
Filed:
Apr. 08, 2019
Applicant:
Kevin R. Williams, Waller, TX (US);
Inventor:
Kevin R. Williams, Waller, TX (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/06 (2006.01); H05K 5/02 (2006.01); H01L 23/50 (2006.01); H01L 23/10 (2006.01); H05K 7/20 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0239 (2013.01); H01L 23/10 (2013.01); H01L 23/3672 (2013.01); H01L 23/50 (2013.01); H05K 5/06 (2013.01); H05K 7/2089 (2013.01);
Abstract
A power semiconductor module has a base plate, a housing affixed to the base plate, a DC busbar affixed to the base plate and the housing, and AC busbar affixed to the base plate and the housing, control electronics positioned in an interior of the housing and connected to the AC and DC busbars, and a sealant material applied to seams between the base plate in the housing, to seams between the DC busbar and the housing, and to seams between the AC busbar in the housing. The sealant material is applied such that the control electronics of the power semiconductor modules are in an air-tight environment.