The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2021

Filed:

Sep. 18, 2017
Applicants:

Ivtouch Co., Ltd., Suzhou, CN;

Soochow University, Suzhou, CN;

Inventors:

Linseng Chen, Suzhou, CN;

Xiaohong Zhou, Suzhou, CN;

Assignees:

IVTOUCH CO., LTD., Suzhou, CN;

SOOCHOW UNIVERSITY, Suzhou, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/10 (2006.01); G06F 3/044 (2006.01); H05K 3/00 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 3/107 (2013.01); G06F 3/044 (2013.01); H05K 3/0014 (2013.01); H05K 3/02 (2013.01); H05K 3/12 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04112 (2013.01); Y10T 29/49155 (2015.01);
Abstract

A method for manufacturing a transparent conductive film includes: using a mold to stamp on a transparent insulating substrate to obtain continuous grooves; or coating a gel layer on a transparent insulating film, then using a mold to stamp on one plane of the gel layer which is away from the transparent insulating film, so as to form solidified grooves; filling the grooves with conductive materials to generate a conductive layer, i.e., an inner circuit; forming an outer circuit on the surface in contact with the conductive layer; removing the unnecessary conductive materials in the inner and outer circuit in accordance with a preset graphic to form insulating channels, and insulating lines; obtaining a transparent conductive film. Screen printing and embedded nano-imprinting are combined, and a unified grid filling system is used as a general-purpose mold to manufacture a transparent conductive film.


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