The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2021
Filed:
Jul. 30, 2019
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventors:
Assignee:
MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/03 (2006.01); B32B 7/12 (2006.01); B32B 15/082 (2006.01); B32B 15/092 (2006.01); B32B 15/20 (2006.01); C08J 5/12 (2006.01); C09J 153/02 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/036 (2013.01); B32B 7/12 (2013.01); B32B 15/082 (2013.01); B32B 15/092 (2013.01); B32B 15/20 (2013.01); C08J 5/125 (2013.01); C09J 153/02 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 1/185 (2013.01); H05K 3/4626 (2013.01); B32B 2305/55 (2013.01); B32B 2307/732 (2013.01); B32B 2457/08 (2013.01); C08J 2453/02 (2013.01); C08J 2463/00 (2013.01); C08J 2463/02 (2013.01); C08J 2463/10 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0195 (2013.01);
Abstract
A metal-clad laminate that includes a metal foil with low surface roughness and in which the adhesion strength between a liquid crystal polymer film and the metal foil is high, the low transmission loss in a high frequency region is low, and the problems associated with warpage and adhesive leakage are alleviated. The metal-clad laminate includes the liquid crystal polymer film, an adhesive layer, and the metal foil, with the adhesive layer and the metal foil stacked on one surface of the liquid crystal polymer film.