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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10959330 B1

PDFFull Text
Date of Patent:
Mar. 23, 2021

Filed:

Jul. 30, 2019

Metal-clad laminate, circuit board, and multilayer circuit board

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Kazuhiko Ohashi, Nagaokakyo, JP;

Sunao Fukutake, Nagaokakyo, JP;

Takeshi Eda, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;

Attorney:

Arent Fox LLP

Primary Examiner:

Yuriy Semenenko

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/03 (2006.01); B32B 7/12 (2006.01); B32B 15/082 (2006.01); B32B 15/092 (2006.01); B32B 15/20 (2006.01); C08J 5/12 (2006.01); C09J 153/02 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/036 (2013.01); B32B 7/12 (2013.01); B32B 15/082 (2013.01); B32B 15/092 (2013.01); B32B 15/20 (2013.01); C08J 5/125 (2013.01); C09J 153/02 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 1/185 (2013.01); H05K 3/4626 (2013.01); B32B 2305/55 (2013.01); B32B 2307/732 (2013.01); B32B 2457/08 (2013.01); C08J 2453/02 (2013.01); C08J 2463/00 (2013.01); C08J 2463/02 (2013.01); C08J 2463/10 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0195 (2013.01);
Abstract

A metal-clad laminate that includes a metal foil with low surface roughness and in which the adhesion strength between a liquid crystal polymer film and the metal foil is high, the low transmission loss in a high frequency region is low, and the problems associated with warpage and adhesive leakage are alleviated. The metal-clad laminate includes the liquid crystal polymer film, an adhesive layer, and the metal foil, with the adhesive layer and the metal foil stacked on one surface of the liquid crystal polymer film.

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Ohashi, Kazuhiko. (2021). Metal-clad laminate, circuit board, and multilayer circuit board (U.S. Patent No. 10959330). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10959330

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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