The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2021
Filed:
Jun. 29, 2018
Applicant:
Tyco Electronics Japan G.k., Kanagawa, JP;
Inventors:
Kenta Sato, Kanagawa, JP;
Heewon Jeong, Kanagawa, JP;
Assignee:
Tyco Electronics Japan G.K., Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 1/11 (2006.01); H05K 5/00 (2006.01); H05K 1/18 (2006.01); B60T 8/17 (2006.01); B60T 8/36 (2006.01); B60T 8/00 (2006.01); B60T 7/04 (2006.01); G01D 11/24 (2006.01); H01R 12/58 (2011.01);
U.S. Cl.
CPC ...
H05K 1/0268 (2013.01); B60T 7/042 (2013.01); B60T 8/00 (2013.01); B60T 8/17 (2013.01); B60T 8/3675 (2013.01); G01D 11/245 (2013.01); H01R 12/585 (2013.01); H05K 1/113 (2013.01); H05K 1/114 (2013.01); H05K 1/141 (2013.01); H05K 5/006 (2013.01); H05K 5/0069 (2013.01); H05K 1/181 (2013.01); H05K 2201/049 (2013.01); H05K 2201/09154 (2013.01); H05K 2201/09418 (2013.01); H05K 2201/09427 (2013.01); H05K 2201/09481 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10295 (2013.01); H05K 2201/10303 (2013.01); H05K 2203/168 (2013.01);
Abstract
A printed circuit board comprises a board main body, a sensor, an external connection pad, and a hollow-structured electrical conductor. The board main body has a top face and a bottom face opposite the top face. The sensor is mounted on one of the top face and the bottom face of the board main body. The external connection pad is provided on the top face or the bottom face of the board main body opposite the sensor. The hollow-structured electrical conductor extends through the board main body and electrically connects the sensor to the external connection pad.