The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2021
Filed:
Apr. 09, 2015
Applicants:
Ictk Holdings Co., Ltd., Seongnam-si, KR;
Iucf-hyu (Industry-university Cooperation Foundation Hanyang University), Seoul, KR;
Inventors:
Assignees:
ICTK Holdings Co., LTD., Seongnam-si, KR;
IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY), Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04L 9/32 (2006.01); H04W 12/02 (2009.01); H04W 12/06 (2021.01); H04L 12/58 (2006.01); G09C 1/00 (2006.01); H04L 9/08 (2006.01); G06F 12/14 (2006.01); G06F 21/44 (2013.01); H04W 88/02 (2009.01); H04W 12/00 (2021.01);
U.S. Cl.
CPC ...
H04L 9/3278 (2013.01); G06F 12/1408 (2013.01); G06F 21/44 (2013.01); G09C 1/00 (2013.01); H04L 9/0866 (2013.01); H04L 51/00 (2013.01); H04W 12/02 (2013.01); H04W 12/06 (2013.01); G06F 2212/1052 (2013.01); H04W 12/00405 (2019.01); H04W 88/02 (2013.01);
Abstract
An interface element connected to a device and a security die-chip are fabricated in a single package. The security die-chip may provide a security authentication function to the interface element that does not have the security authentication function. The security die-chip may include a physically unclonable function (PUF) to provide a private key, and a hardware security module to perform encryption and decryption using the private key.