The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2021

Filed:

Oct. 17, 2014
Applicant:

Solar Frontier K.k., Tokyo, JP;

Inventors:

Tatsuji Kanbara, Tokyo, JP;

Shinji Kato, Tokyo, JP;

Toshiaki Yamaura, Tokyo, JP;

Natsuki Hamada, Tokyo, JP;

Tetsuji Itou, Tokyo, JP;

Bagwadkar Ninad, Tochigi, JP;

Tomoyasu Yamada, Tokyo, JP;

Mitsuru Arasaki, Tokyo, JP;

Hideki Sakai, Tokyo, JP;

Mitsuru Onoda, Tokyo, JP;

Yuuki Narita, Tokyo, JP;

Assignee:

Solar Frontier K.K., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02S 30/10 (2014.01); H02S 40/34 (2014.01); H02S 40/42 (2014.01); H02S 20/23 (2014.01); H02S 20/24 (2014.01); H02S 40/36 (2014.01); H02S 20/10 (2014.01); H02S 30/00 (2014.01); F24S 25/16 (2018.01); F24S 25/10 (2018.01); F24S 25/35 (2018.01); F24S 25/33 (2018.01); F24S 25/61 (2018.01); F24S 25/11 (2018.01); F24S 25/60 (2018.01);
U.S. Cl.
CPC ...
H02S 30/10 (2014.12); F24S 25/10 (2018.05); F24S 25/11 (2018.05); F24S 25/16 (2018.05); F24S 25/33 (2018.05); F24S 25/35 (2018.05); F24S 25/61 (2018.05); H02S 20/10 (2014.12); H02S 20/23 (2014.12); H02S 20/24 (2014.12); H02S 30/00 (2013.01); H02S 40/34 (2014.12); H02S 40/36 (2014.12); H02S 40/42 (2014.12); H02S 40/425 (2014.12); F24S 2025/601 (2018.05); Y02B 10/10 (2013.01); Y02E 10/47 (2013.01); Y02E 10/50 (2013.01);
Abstract

In an attachment structure for attaching a photovoltaic cell module having flexibility to an installation surface or an attachment member, a back surface of the photovoltaic cell module is attached to the installation surface or the attachment member by being adhered by an adhesive material.


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