The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2021
Filed:
Mar. 30, 2017
Applicant:
Nidec Corporation, Kyoto, JP;
Inventors:
Takashi Hattori, Kyoto, JP;
Takahiro Kizu, Kyoto, JP;
Toshiya Okamoto, Kyoto, JP;
Yuichi Nishikawa, Kyoto, JP;
Yoshiaki Yamashita, Kyoto, JP;
Assignee:
NIDEC CORPORATION, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 3/50 (2006.01); H02K 5/16 (2006.01); H02K 11/33 (2016.01); H02K 3/12 (2006.01); H02K 3/38 (2006.01); H02K 5/26 (2006.01); B62D 5/04 (2006.01); H02K 5/22 (2006.01); H02K 7/08 (2006.01); H02K 9/22 (2006.01); H02K 15/14 (2006.01); H02K 11/30 (2016.01); H02K 3/04 (2006.01); H02K 5/04 (2006.01); H02K 15/085 (2006.01); H01R 13/52 (2006.01);
U.S. Cl.
CPC ...
H02K 5/26 (2013.01); B62D 5/04 (2013.01); B62D 5/0403 (2013.01); B62D 5/0409 (2013.01); H02K 3/04 (2013.01); H02K 3/12 (2013.01); H02K 3/38 (2013.01); H02K 3/50 (2013.01); H02K 5/04 (2013.01); H02K 5/161 (2013.01); H02K 5/22 (2013.01); H02K 5/225 (2013.01); H02K 7/08 (2013.01); H02K 7/083 (2013.01); H02K 9/22 (2013.01); H02K 11/30 (2016.01); H02K 11/33 (2016.01); H02K 15/085 (2013.01); H02K 15/14 (2013.01); H01R 13/52 (2013.01); H02K 2203/09 (2013.01); H02K 2211/03 (2013.01);
Abstract
A motor includes a heat sink including an inner region, and an outer region located radially outward from the inner region. An axial thickness of the inner region is larger than an axial thickness of the outer region, the bottom surface of the outer region is located axially above the bottom surface of the inner region, and the inner region and the electronic component at least partially overlap in an axial direction. A bus bar holder is located axially below the outer region and overlaps the inner region in a radial direction.