The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2021

Filed:

Mar. 30, 2017
Applicant:

Nidec Corporation, Kyoto, JP;

Inventors:

Takahiro Kizu, Kyoto, JP;

Takashi Hattori, Kyoto, JP;

Toshiya Okamoto, Kyoto, JP;

Yuichi Nishikawa, Kyoto, JP;

Yoshiaki Yamashita, Kyoto, JP;

Assignee:

NIDEC CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 5/04 (2006.01); H02K 11/00 (2016.01); H02K 9/22 (2006.01); H02K 5/26 (2006.01); B62D 5/04 (2006.01); H02K 3/50 (2006.01); H02K 5/16 (2006.01); H02K 5/22 (2006.01); H02K 7/08 (2006.01); H02K 11/33 (2016.01); H02K 3/12 (2006.01); H02K 15/14 (2006.01); H02K 3/38 (2006.01); H02K 11/30 (2016.01); H02K 3/04 (2006.01); H02K 15/085 (2006.01); H01R 13/52 (2006.01);
U.S. Cl.
CPC ...
H02K 5/26 (2013.01); B62D 5/04 (2013.01); B62D 5/0403 (2013.01); B62D 5/0409 (2013.01); H02K 3/04 (2013.01); H02K 3/12 (2013.01); H02K 3/38 (2013.01); H02K 3/50 (2013.01); H02K 5/04 (2013.01); H02K 5/161 (2013.01); H02K 5/22 (2013.01); H02K 5/225 (2013.01); H02K 7/08 (2013.01); H02K 7/083 (2013.01); H02K 9/22 (2013.01); H02K 11/30 (2016.01); H02K 11/33 (2016.01); H02K 15/085 (2013.01); H02K 15/14 (2013.01); H01R 13/52 (2013.01); H02K 2203/09 (2013.01); H02K 2211/03 (2013.01);
Abstract

A motor includes a rotor with a shaft that extends axially, a stator that surrounds a radial outer side of the rotor, a heat sink that is axially above the stator and provided with cavities that pass conductors therethrough and extend axially, and a substrate that is axially above the heat sink and includes an electronic component mounted thereon, wherein the heat sink includes a contact surface that contacts the substrate or electronic component directly or via a heat dissipating member and an exposed surface that does not come into contact with other members, wherein the exposed surface is located closer to an outer edge than the cavities.


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